Specifications

Substrate Materials

CX Thin Films offers the following substrate materials. For more details on the types of products available, please download our catalog or contact sales.

Material Size Standard Thickness(1) Surface Finish Dielectric Constant
(At 1 MHz)
Coefficient of Thermal Expansion
(× 10-6 / °C)
Silicon (Si)
(With 12 kÅ SiO2)
3 in Diameter 0.010 in Chemical Polish N/A
(SiO2 1.38)
2.49 – 4.44
(25°C to < 1000°C)
Alumina
(Al2O3)
To 4 in square 0.010 in 2 μin – 3 μin 9.9 7
(25°C to 300°C)
Polished Alumina
(Al2O3)
To 4 in square 0.010 in To < 2 μin 9.9 7
(25°C to 300°C)
Quartz
(Fused Silica)
3 in diameter 0.010 in 60 / 40
Optical Polish
3.826 0.55
(25°C to 320°C)
Berylium Oxide
(BeO)
2.25 in square 0.010 in < 5 μin 6.76 9
(25°C to < 1000°C)
Aluminum Nitride
(AlN)
2.25 in square 0.010 in 6 μin – 8 μin 8.0 – 9.1 4.6 – 5.7
(25°C to < 1000°C)

Standard dimensional tolerance for length and width is ± 0.002 in. The thickness tolerance is ± 0.001 in.

(1) Standard thickness on chip size of 12 × 9 is 0.005 in.


Testing Specifications

All CX Thin Films products meet or exceed MIL-PRF-55342 testing and standards. The table below shows the appropriate specification for each type of testing.

Testing Performed Specification / Standard
Visual Inspection MIL-PRF-55342
MIL-STD-883
Mechanical Inspection MIL-PRF-55342
DC Resistance MIL-PRF-55342
MIL-STD-202
Resistance Temperature Characteristics (TCR) MIL-PRF-55342
MIL-STD-202
Short Time Overload MIL-PRF-55342
High Temperature Exposure MIL-PRF-55342
Thermal Shock MIL-PRF-55342
MIL-STD-202
Resistance to Bonding Exposure MIL-PRF-55342
Wire Bonding Integrity MIL-PRF-55342
Life Test MIL-PRF-55342
MIL-STD-202